PCB circuit board laser cleaning
As semiconductor technology continues to shrink, advanced integrated circuit devices have been transformed from planar structures to three-dimensional structures, and integrated circuit manufacturing processes have become increasingly complex, often requiring hundreds or even thousands of process steps. For the manufacture of advanced semiconductor devices, after each process, there will be more or less particle contamination, metal residues or organic residues on the surface of the silicon wafer. The shrinking device feature size and the increasing complexity of three-dimensional device structures make semiconductor devices increasingly sensitive to particle contamination, impurity concentration and quantity. Higher requirements are placed on the cleaning technology of the contamination particles on the surface of the silicon wafer mask. The key is to overcome the enormous adsorption force between the contaminating particles and the substrate. Traditional chemical laser cleaning, mechanical laser cleaning, and ultrasonic laser cleaning cannot meet the needs, while laser cleaning can easily solve such pollution problems.
In addition, as the size of integrated circuit devices continues to shrink, material loss and surface roughness during laser cleaning have also become issues that must be paid attention to. Removal of particles without loss of material and pattern damage is the most basic requirement. The incomparable advantages of traditional laser cleaning methods, such as contact type, no thermal effect, no surface damage to the object to be cleaned, and no secondary pollution, are the laser cleaning methods to solve the pollution of semiconductor devices.
